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UPH Heatsink Compounds Laptop Gadget
- Primary Use: Thermal coupling of electrical / electronic devices to heat sinks.
- Special Properties: High conductivity; Low bleed; Stable at high temperatures.
- Type: Silicone fluid
- Thermal Resistance: <0.06 degree C-in2/W
- Thermal Conductivity: >4.5 W/m-k
- Dielectric Breakdown: >5.0 KV ac
- Physical Form: Grease-like
- Color: Gray opaque
- N.W. 30 gram
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